Skip to main content

AMD/Xilinx XC6SLX75T-3FTG256I FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 45nm process technology.

In Stock ActiveAMD/XilinxXC6SLX75FTBGARoHS
XC6SLX75T-3FTG256I - No Image Available

Same model may have multiple batches, images only for reference.

XC6SLX75T-3FTG256I
Manufacturer
Part Number (MPN)
XC6SLX75T-3FTG256I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 45nm process technology. Features 186 maximum user I/Os, 93,296 registers, 3096 Kbit RAM bits, and 264 (18x18) multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps, 132 dedicated DSPs, and 1 PCI block. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting. Operates across a temperature range of -40°C to 100°C.
Package
FTBGA
Key Features
Package: FTBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX75T-3FTG256I Datasheet
Quick Jump:
Ready to order?In stock and ready to ship.
Competitive Pricing
Fast & Reliable Delivery
Quality Assured

Ordering Code Family

XC6SLX75 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

83 ordering variants listed on the family page.

View all variants

Technical Specifications

AMD/Xilinx XC6SLX75T-3FTG256I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Number of Pins
256
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pcb
256

Alternate Parts Comparison (XC6SLX75T-3FTG256I vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
PackageFTBGA484-FBGA, CSPBGA484-BBGA484-FBGA, CSPBGA
Package / Case--484-CSPBGA484-FBGA484-CSPBGA
Supply Voltage--1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Number of I/O--328280328
Number of LABs/CLBs--583158315831
Number of Logic Elements Cells--746377463774637
Total RAM Bits--317030431703043170304
Action

AMD/Xilinx XC6SLX75T-3FTG256I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 45nm process technology. Features 186 maximum user I/Os, 93,296 registers, 3096 Kbit RAM bits, and 264 (18x18) multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps, 132 dedicated DSPs, and 1 PCI block. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting.

Operates across a temperature range of -40°C to 100°C.

More Parts in FPGAs (Field Programmable Gate Array)

Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.