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AMD/Xilinx XC6SLX75T-3FG484I FPGAs (Field Programmable Gate Array)

IC FPGA 268 I/O 484FBGA

In Stock ActiveAMD/XilinxXC6SLX75FBGARoHS
XC6SLX75T-3FG484I FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX75T-3FG484I
Manufacturer
Part Number (MPN)
XC6SLX75T-3FG484I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers, built on 45nm process technology. Offers 3,096 Kbit RAM bits, 264 dedicated 18x18 multipliers, and 132 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps, 1 PCI block, and 18 DLLs/PLLs. Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm, and operates across an industrial temperature range of -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF XC6SLX75T-3FG484I Datasheet
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Ordering Code Family

XC6SLX75 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

83 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX75T-3FG484I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
No
Number of Pins
484
Package / Case
484-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA

Related Parts Comparison (XC6SLX75T-3FG484I vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case484-BBGA484-FBGA484-BBGA484-FBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSNoYesYesYes
Lifecycle StatusActiveActiveActiveActive
Number of I/O268328280328
Number of LABs/CLBs5831583158315831
Number of Logic Elements Cells74637746377463774637
PackageFBGA484-FBGA, CSPBGA484-BBGA484-FBGA, CSPBGA
Total RAM Bits3170304317030431703043170304
Series--XC6SLX75XC6SLX75XC6SLX75
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AMD/Xilinx XC6SLX75T-3FG484I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers, built on 45nm process technology. Offers 3,096 Kbit RAM bits, 264 dedicated 18x18 multipliers, and 132 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps, 1 PCI block, and 18 DLLs/PLLs.

Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm, and operates across an industrial temperature range of -40°C to 100°C.

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