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AMD/Xilinx XC6SLX75T-2FG676I FPGAs (Field Programmable Gate Array)

IC FPGA 348 I/O 676FCBGA

In Stock ActiveAMD/XilinxXC6SLX75FBGARoHS
XC6SLX75T-2FG676I FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX75T-2FG676I
Manufacturer
Part Number (MPN)
XC6SLX75T-2FG676I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 264 dedicated 18x18 multipliers, and 132 dedicated DSP blocks. Offers 348 maximum user I/Os, 8 transceiver blocks operating at 3.2 Gbps, and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with an operating temperature range of -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF XC6SLX75T-2FG676I Datasheet
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Ordering Code Family

XC6SLX75 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

83 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX75T-2FG676I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
No
Number of Pins
676
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA

Alternate Parts Comparison (XC6SLX75T-2FG676I vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case676-BGA484-FBGA484-BBGA484-FBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSNoYesYesYes
Lifecycle StatusActiveActiveActiveActive
Number of I/O348328280328
Number of LABs/CLBs5831583158315831
Number of Logic Elements Cells74637746377463774637
PackageFBGA484-FBGA, CSPBGA484-BBGA484-FBGA, CSPBGA
Total RAM Bits3170304317030431703043170304
Series--XC6SLX75XC6SLX75XC6SLX75
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AMD/Xilinx XC6SLX75T-2FG676I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 264 dedicated 18x18 multipliers, and 132 dedicated DSP blocks. Offers 348 maximum user I/Os, 8 transceiver blocks operating at 3.2 Gbps, and 1 PCI block.

Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with an operating temperature range of -40°C to 100°C.

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