AMD/Xilinx XC6SLX4-2FG900I FPGAs (Field Programmable Gate Array)
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology.
Same model may have multiple batches, images only for reference.
Technical Specifications
AMD/Xilinx XC6SLX4-2FG900I FPGAs (Field Programmable Gate Array) technical specifications.
General
Related Parts Comparison (XC6SLX4-2FG900I vs XC6SLX4-3CPG196I vs XC6SLX4-3CSG225I vs XC6SLX4-2CPG196I)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
| Package | FBGA | -- | 225-LFBGA, CSPBGA | 196-TFBGA, CSBGA |
| Package / Case | -- | 196-TFBGA, CSBGA | 225-LFBGA, CSPBGA | 196-TFBGA, CSBGA |
| Supply Voltage | -- | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Lifecycle Status | -- | Active | Active | Active |
| Number of I/O | -- | 106 | 132 | 106 |
| Number of LABs/CLBs | -- | 300 | 300 | 300 |
| Number of Logic Elements Cells | -- | 3840 | 3840 | 3840 |
| Total RAM Bits | -- | 221184 | 221184 | 221184 |
| Action |
AMD/Xilinx XC6SLX4-2FG900I FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 16 (18x18) multipliers, and 8 dedicated DSP blocks. Offers 576 maximum user I/Os and 6 DLLs/PLLs. Operates with 3.2 Gbps transceiver speed and SRAM program memory.
Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with dimensions of 31x31x1.75mm and a 1mm pin pitch. Operates across a temperature range of -40°C to 100°C.
