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AMD/Xilinx XC6SLX4-2FG676C FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers.

In Stock ActiveAMD/XilinxSpartan®-6 LXXC6SLX4FBGARoHS
XC6SLX4-2FG676C FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX4-2FG676C
Manufacturer
Part Number (MPN)
XC6SLX4-2FG676C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers. Features 216 Kbit RAM, 12 block RAMs, and 8 dedicated DSP blocks. Utilizes 45nm process technology, offering 16 integrated 18x18 multipliers and 6 DLLs/PLLs. Supports transceiver speeds up to 3.2 Gbps. Housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27mm with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF XC6SLX4-2FG676C Datasheet
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Ordering Code Family

XC6SLX4 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

10 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX4-2FG676C FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
No
Number of Pins
676
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
676

Related Parts Comparison (XC6SLX4-2FG676C vs XC6SLX4-3CPG196I vs XC6SLX4-3CSG225I vs XC6SLX4-2CPG196I)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)
PackageFBGA--225-LFBGA, CSPBGA196-TFBGA, CSBGA
Package / Case--196-TFBGA, CSBGA225-LFBGA, CSPBGA196-TFBGA, CSBGA
Supply Voltage--1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Lifecycle Status--ActiveActiveActive
Number of I/O--106132106
Number of LABs/CLBs--300300300
Number of Logic Elements Cells--384038403840
Total RAM Bits--221184221184221184
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AMD/Xilinx XC6SLX4-2FG676C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers. Features 216 Kbit RAM, 12 block RAMs, and 8 dedicated DSP blocks. Utilizes 45nm process technology, offering 16 integrated 18x18 multipliers and 6 DLLs/PLLs. Supports transceiver speeds up to 3.2 Gbps. Housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27mm with a 1mm pin pitch, suitable for surface mounting.

Operates within a temperature range of 0°C to 85°C.

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