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AMD/Xilinx XC6SLX150T-3FGG676I FPGAs (Field Programmable Gate Array)

IC FPGA 396 I/O 676FBGA

3,655 ActiveAMD/XilinxXC6SLX150FBGA$147.31RoHS
XC6SLX150T-3FGG676I FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX150T-3FGG676I
Manufacturer
Part Number (MPN)
XC6SLX150T-3FGG676I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM bits, 360 18x18 multipliers, and 180 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, measuring 27mm x 27mm x 1.73mm. Operates across an industrial temperature range of -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX150T-3FGG676I Datasheet
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Ordering Code Family

XC6SLX150 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

121 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX150T-3FGG676I FPGAs (Field Programmable Gate Array) technical specifications.

General

Series
XC6SLX150T
RoHS
Yes
Number of Pins
676
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA

Alternate Parts Comparison (XC6SLX150T-3FGG676I vs XC6SLX150-2FGG484C vs XC6SLX150-3FGG484C vs XC6SLX150-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
PackageFBGAFCBGA-484484-BBGA484-FBGA, CSPBGA
Package / Case676-BGA484-BBGA484-BBGA484-FBGA
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Number of I/O396338338338
Number of LABs/CLBs11519115191151911519
Number of Logic Elements Cells147443147443147443147443
Total RAM Bits4939776493977649397764939776
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AMD/Xilinx XC6SLX150T-3FGG676I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM bits, 360 18x18 multipliers, and 180 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, measuring 27mm x 27mm x 1.73mm.

Operates across an industrial temperature range of -40°C to 100°C.

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