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AMD/Xilinx XC6SLX150-3FGG900I FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology.

1,333 ActiveAMD/XilinxXC6SLX150FBGA$3900.00RoHS
XC6SLX150-3FGG900I - No Image Available

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XC6SLX150-3FGG900I
Manufacturer
Part Number (MPN)
XC6SLX150-3FGG900I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. This surface-mount device utilizes a 900-pin Fine Pitch Ball Grid Array (FBGA) package measuring 31x31x1.75mm with a 1mm pin pitch. Operates across a temperature range of -40°C to 100°C, offering 576 maximum user I/Os and 3.2 Gbps transceiver speed.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX150-3FGG900I Datasheet
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Ordering Code Family

XC6SLX150 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

121 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX150-3FGG900I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Number of Pins
900
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
900

Alternate Parts Comparison (XC6SLX150-3FGG900I vs XC6SLX150-2FGG484C vs XC6SLX150-3FGG484C vs XC6SLX150-2CSG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C0°C ~ 85°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)
PackageFBGA--484-BBGA484-FBGA, CSPBGA
Package / Case--484-BBGA484-FBGA484-CSPBGA
Supply Voltage--1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Number of I/O--338338338
Number of LABs/CLBs--115191151911519
Number of Logic Elements Cells--147443147443147443
Total RAM Bits--493977649397764939776
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AMD/Xilinx XC6SLX150-3FGG900I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. This surface-mount device utilizes a 900-pin Fine Pitch Ball Grid Array (FBGA) package measuring 31x31x1.75mm with a 1mm pin pitch.

Operates across a temperature range of -40°C to 100°C, offering 576 maximum user I/Os and 3.2 Gbps transceiver speed.

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