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AMD/Xilinx XC3S500E-4FTG256I FPGAs (Field Programmable Gate Array)

IC FPGA 190 I/O 256FTBGA

1,000 ActiveAMD/XilinxXC3S500256-LBGA$49.52
XC3S500E-4FTG256I - No Image Available

Same model may have multiple batches, images only for reference.

XC3S500E-4FTG256I
Manufacturer
Part Number (MPN)
XC3S500E-4FTG256I
Base Model
Detailed Description
IC FPGA 190 I/O 256FTBGA
Package
256-LBGA
Key Features
Package: 256-LBGA; Supply Voltage: 1.14V ~ 1.26V
Lifecycle Status
Active
Datasheet
PDF XC3S500E-4FTG256I Datasheet
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Ordering Code Family

XC3S500 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

6 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC3S500E-4FTG256I FPGAs (Field Programmable Gate Array) technical specifications.

General

Package / Case
256-FTBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Package
256-LBGA
Number of I/O
190
Number of LABs/CLBs
1164
Number of Logic Elements Cells
10476
Number of Gates
500000
Total RAM Bits
368640

Alternate Parts Comparison (XC3S500E-4FTG256I vs XC3S5000-4FG1156C vs XC3S5000-4FGG1156C vs XC3S500E-4FTG256C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Supply Voltage1.14V ~ 1.26V1.14 ~ 1.261.14V ~ 1.26V1.14V ~ 1.26V
Number of Gates50000050000005000000500000
Total RAM Bits368640--1916928368640
Package / Case256-FTBGA----256-FTBGA
Operating Temperature-40°C ~ 100°C (TJ)----0°C ~ 85°C (TJ)
Number of I/O190----190
Number of LABs/CLBs1164----1164
Number of Logic Elements Cells10476----10476
Package256-LBGA----256-LBGA
Jedec Package Code--S-PBGA-B1156S-PBGA-B1156--
Lead Free--NoYes--
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