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AMD/Xilinx XA3S1200E-4FTG256Q FPGAs (Field Programmable Gate Array)

IC FPGA 190 I/O 256FTBGA

19,673 ActiveAMD/Xilinx256-LBGA$1271.36RoHS
XA3S1200E-4FTG256Q - No Image Available

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XA3S1200E-4FTG256Q
Manufacturer
Part Number (MPN)
XA3S1200E-4FTG256Q
Detailed Description
Advanced AMD/Xilinx XA3S1200E-4FTG256Q FPGAs for precision electronics.
Package
256-LBGA
Key Features
IC FPGA 190 I/O 256FTBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XA3S1200E-4FTG256Q Datasheet
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Technical Specifications

AMD/Xilinx XA3S1200E-4FTG256Q FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Supplier Package
256-FTBGA (17x17)
Number of Gates
1200000
Terminal Position
BOTTOM
Jedec Package Code
S-PBGA-B256
Width
17
Length
17

Alternate Parts Comparison (XA3S1200E-4FTG256Q vs XC7A35T-2FTG256I vs XC7A50T-L1FTG256I vs XC7A100T-L1FTG256I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TJ)-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)
Supply Voltage1.14V ~ 1.26V0.95V ~ 1.05V0.95V ~ 1.05V0.95V ~ 1.05V
Package256-LBGA--256-LBGA256-LBGA
Package / Case--256-LBGA256-FTBGA256-FTBGA
Number of I/O--170170170
Number of LABs/CLBs--260040757925
Number of Logic Elements Cells--3328052160101440
Total RAM Bits--184320027648004976640
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