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AMD/Xilinx XC3S1200E-4FTG256I FPGAs (Field Programmable Gate Array)

IC FPGA 190 I/O 256FTBGA

6 ActiveAMD/XilinxXC3S1200256-LBGA$85.82
XC3S1200E-4FTG256I 256-LBGA package illustration

Same model may have multiple batches, images only for reference.

XC3S1200E-4FTG256I
Manufacturer
Part Number (MPN)
XC3S1200E-4FTG256I
Base Model
Detailed Description
IC FPGA 190 I/O 256FTBGA
Package
256-LBGA
Key Features
Package: 256-LBGA; Supply Voltage: 1.14V ~ 1.26V
Lifecycle Status
Active
Datasheet
PDF XC3S1200E-4FTG256I Datasheet
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Ordering Code Family

XC3S1200 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

2 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC3S1200E-4FTG256I FPGAs (Field Programmable Gate Array) technical specifications.

General

Series
XC3S1200E
RoHS
Yes
Package / Case
256-LBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Package
256-LBGA
Number of I/O
190
Number of LABs/CLBs
2168

Alternate Parts Comparison (XC3S1200E-4FTG256I vs XC3S1200E-4FTG256C vs XC3S1200E-4FGG320I vs XC3S1200E-4FGG400C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesXC3S1200EXC3S1200EXC3S1200EXC3S1200E
Package / Case256-LBGA256-LBGA320-BGA400-BGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Collector Emitter Saturation Voltage1.2 V1.2 V1.2 V1.2 V
Distributed RAM136 kbit136 kbit136 kbit136 kbit
Embedded Block RAM Ebr504 kbit504 kbit504 kbit504 kbit
Maximum Operating Frequency300 MHz300 MHz300 MHz300 MHz
Maximum Operating Temperature C+ 100+ 85+ 100+ 85
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