AMD/Xilinx XC2C512-10FGG324I CPLDs (Complex Programmable Logic Devices)
IC CPLD 512MC 9.2NS 324FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC2C512-10FGG324I
Category
Detailed Description
IC CPLD 512MC 9.2NS 324FBGA
Package
324-BBGA
Key Features
Package: 324-BBGA
Lifecycle Status
Active
Datasheet
XC2C512-10FGG324I Datasheet
Quick Jump:
Technical Specifications
AMD/Xilinx XC2C512-10FGG324I CPLDs (Complex Programmable Logic Devices) technical specifications.
General
Package / Case
324-FBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Package
324-BBGA
Programmable Type
In System Programmable
Delay Time Tpd 1 Max
9.2 ns
Voltage Supply Internal
1.7V ~ 1.9V
Number of Logic Elements Blocks
32
Number of Macrocells
512
Number of I/O
270
Alternate Parts Comparison (XC2C512-10FGG324I vs XC6SLX25T-2CSG324C vs XC6SLX45T-2FGG484I vs XC6SLX25T-2FGG484C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 85°C | -40°C ~ 100°C | 0°C ~ 85°C |
| Package | 324-BBGA | CSBGA | FBGA | FBGA |
| Number of Pins | -- | 324 | 484 | 484 |
| AEC Qualified | -- | No | No | No |
| Automotive | -- | No | No | No |
| Basic Package Type | -- | Ball Grid Array | Ball Grid Array | Ball Grid Array |
| Cage Code | -- | 68994 | 68994 | 68994 |
| Dedicated DSP | -- | 38 | 58 | 38 |
| Device Logic Cells | -- | 24051 | 43661 | 24051 |
| Device Number of Dlls Plls | -- | 6 | 12 | 6 |
| External Memory Interface | -- | DDR SDRAM/DDR2 SDRAM/DDR3 SDRAM/LPDDR SDRAM | DDR SDRAM/DDR2 SDRAM/DDR3 SDRAM/LPDDR SDRAM | DDR SDRAM/DDR2 SDRAM/DDR3 SDRAM/LPDDR SDRAM |
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