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AMD/Xilinx XC6SLX25T-2FGG484C FPGAs (Field Programmable Gate Array)

IC FPGA 250 I/O 484FBGA

2,886 ActiveAMD/XilinxXC6SLX25FBGA$52.52RoHS
XC6SLX25T-2FGG484C FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX25T-2FGG484C
Manufacturer
Part Number (MPN)
XC6SLX25T-2FGG484C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm. Operates within a temperature range of 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX25T-2FGG484C Datasheet
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Ordering Code Family

XC6SLX25 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

114 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX25T-2FGG484C FPGAs (Field Programmable Gate Array) technical specifications.

General

Series
XC6SLX25T
RoHS
Yes
Number of Pins
484
Package / Case
484-BBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA

Alternate Parts Comparison (XC6SLX25T-2FGG484C vs XC6SLX25-2CSG324I vs XC6SLX25-2FGG484I vs XC6SLX25-3FTG256C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesXC6SLX25TXC6SLX25XC6SLX25XC6SLX25
Package / Case484-BBGA324-LFBGA, CSPBGA484-BBGA256-LBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
Number of Pins484324484256
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Adaptive Logic Modules Alms3758 ALM3758 ALM3758 ALM3758 ALM
AEC QualifiedNoNoNoNo
AutomotiveNoNoNoNo
Basic Package TypeBall Grid ArrayBall Grid ArrayBall Grid ArrayBall Grid Array
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AMD/Xilinx XC6SLX25T-2FGG484C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block.

Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm. Operates within a temperature range of 0°C to 85°C.

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