AMD/Xilinx XC17S200APDG8C Configuration PROMs for FPGAs
IC PROM SER 200K C-TEMP 8-DIP
Same model may have multiple batches, images only for reference.
Technical Specifications
AMD/Xilinx XC17S200APDG8C Configuration PROMs for FPGAs technical specifications.
General
Related Parts Comparison (XC17S200APDG8C vs XC17S40XLSO20I vs XC17S100AVO8I vs XC17S15AVOG8C)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 8-DIP | 20-SOIC | 8-SOIC | 8-SOIC |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 70°C | -40°C ~ 85°C | -40°C ~ 85°C | 0°C ~ 70°C |
| Supply Voltage | 3.3 | 3.3 | 3.3 | 3.3 |
| Memory Size | 2MB | 400kB | 1MB | 150kb |
| Interface | CONFIGURATION MEMORY | MEMORY CIRCUIT | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| Number of Pins | 8 | 20 | 8 | 8 |
| RoHS | Yes | No | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| IO Type | COMMON | COMMON | COMMON | COMMON |
| Jedec Package Code | R-PDIP-T8 | R-PDSO-G20 | R-PDSO-G8 | R-PDSO-G8 |
| Length | 9.3599 | 12.8 | 4.9 | 4.9 |
| Action |
AMD/Xilinx XC17S200APDG8C Configuration PROMs for FPGAs Overview
The XC17S200APDG8C is an 8-pin DIP packaged FPGA configuration memory from Xilinx. It operates over a commercial temperature range of 0 to 70 degrees Celsius and has a maximum supply voltage of 3.6V. The device has a maximum supply current of 15mA and a standby current of 1uA.
It is a serial configuration memory with a memory capacity of 1335840 words.
