AMD/Xilinx XC17S50APD8C Configuration PROMs for FPGAs
IC PROM SER 50000 C-TEMP 8-DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC17S50APD8C
Base Model
Detailed Description
FPGA Configuration PROM Memories
Package
8-DIP (0.300", 7.62mm)
Lifecycle Status
Obsolete
RoHS State
No
Datasheet
XC17S50APD8C Datasheet
Quick Jump:
Technical Specifications
AMD/Xilinx XC17S50APD8C Configuration PROMs for FPGAs technical specifications.
General
Interface
CONFIGURATION MEMORY
Memory Size
500kb
RoHS
No
Number of Pins
8
Package / Case
8-DIP
Mounting Type
Through Hole
Operating Temperature
0°C ~ 70°C
Supply Voltage
3.3
Lifecycle Status
Obsolete
Terminal Position
DUAL
Alternate Parts Comparison (XC17S50APD8C vs XC17S40XLSO20I vs XC17S100AVO8I vs XC17S15AVOG8C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-DIP | 20-SOIC | 8-SOIC | 8-SOIC |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 70°C | -40°C ~ 85°C | -40°C ~ 85°C | 0°C ~ 70°C |
| Supply Voltage | 3.3 | 3.3 | 3.3 | 3.3 |
| Memory Size | 500kb | 400kB | 1MB | 150kb |
| Interface | CONFIGURATION MEMORY | MEMORY CIRCUIT | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| Number of Pins | 8 | 20 | 8 | 8 |
| RoHS | No | No | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| IO Type | COMMON | COMMON | COMMON | COMMON |
| Jedec Package Code | R-PDIP-T8 | R-PDSO-G20 | R-PDSO-G8 | R-PDSO-G8 |
| Length | 9.3599 | 12.8 | 4.9 | 4.9 |
| Action |
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