Winbond Electronics W987D6HBGX6E Memory ICs
IC DRAM 128MBIT PARALLEL 54VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W987D6HBGX6E
Detailed Description
IC DRAM 128MBIT PARALLEL 54VFBGA
Package
54-TFBGA
Lifecycle Status
Last Time Buy
Datasheet
W987D6HBGX6E Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W987D6HBGX6E Memory ICs technical specifications.
General
Memory Size
128Mb (8M x 16)
RoHS
ROHS3 Compliant
Package / Case
54-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-25°C ~ 85°C (TC)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Obsolete
Package
54-TFBGA
Technology
SDRAM - Mobile LPSDR
Memory Type
Volatile
Alternate Parts Comparison (W987D6HBGX6E vs W9825G6KH-6 vs W9812G6KH-6 vs W631GG8NB-12 TR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -25°C ~ 85°C (TC) | 0 ~ 70 | 0 ~ 70 | 0°C ~ 95°C (TC) |
| Supply Voltage | 1.7V ~ 1.95V | 3 ~ 3.6 | 3 ~ 3.6 | 1.425V ~ 1.575V |
| Memory Size | 128Mb (8M x 16) | 256M | 128M | 1Gbit |
| RoHS | ROHS3 Compliant | Compliant | Compliant | -- |
| Lifecycle Status | Obsolete | Active | Active | -- |
| Package | 54-TFBGA | SO | SO | -- |
| Action |
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