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Winbond Electronics W971GG8SB-25 DRAM

DRAM Memory IC 1Gbit Parallel 200 MHz 1.7V ~ 1.9V 60-WBGA (8x12.5)

14,720Winbond Electronics60-WBGA (8x12.5)$11.47RoHS
W971GG8SB-25 60-WBGA (8x12.5) package illustration

Same model may have multiple batches, images only for reference.

W971GG8SB-25
Part Number (MPN)
W971GG8SB-25
Detailed Description
IC DRAM 1GBIT PARALLEL 60WBGA
Package
60-WBGA (8x12.5)
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF W971GG8SB-25 Datasheet
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Technical Specifications

Winbond Electronics W971GG8SB-25 DRAM technical specifications.

General

Memory Size
1Gbit
RoHS
ROHS3 Compliant
Package / Case
60-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TC)
Supply Voltage
1.7V ~ 1.9V
Lifecycle Status
Obsolete
Max Frequency
200 MHz
Memory Type
Volatile

Related Parts Comparison (W971GG8SB-25 vs W9825G6KH-6 vs W9725G8KB-25 vs W9725G8KB25I)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TC)0 ~ 700°C ~ 85°C (TC)-40°C ~ 95°C (TC)
Supply Voltage1.7V ~ 1.9V3 ~ 3.61.7V ~ 1.9V1.7V ~ 1.9V
Memory Size1Gbit256M256 Mbit256 Mbit
RoHSROHS3 CompliantCompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusObsoleteActiveNot For New DesignsNot For New Designs
Access Time57.5 ns6 ns57.5 ns57.5 ns
Memory Organization128M x 816 M x 1632M x 832M x 8
Package / Case60-TFBGA--60-TFBGA60-TFBGA
Clock Frequency200 MHz--200 MHz200 MHz
Max Frequency200 MHz--200 MHz200 MHz
Memory FormatDRAM--DRAMDRAM
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