Winbond Electronics W66CQ2NQQAHJ DRAM
4GB LPDDR4X, DDP, X32, 2133MHZ,
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CQ2NQQAHJ
Detailed Description
Package
200-TFBGA (10x14.5)
Key Features
Package: Tray; Package / Case: 200-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V; Memory Size: 4Gbit
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W66CQ2NQQAHJ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W66CQ2NQQAHJ DRAM technical specifications.
General
Max Frequency
2.133 GHz
Operating Temperature
-40°C ~ 105°C (TC)
Memory Interface
LVSTL_11
Memory Organization
128M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
200-TFBGA (10x14.5)
Access Time
3.6 ns
Write Cycle Time Word Page
18ns
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W66BP6NBQAFJWinbond ElectronicsPackage: Tray | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 128 M x 16
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W66AQ6NBQAFJWinbond ElectronicsPackage: Tray | Package / Case: 200-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 64 M x 16
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