Winbond Electronics W66BQ6NBHAHJ DRAM
2GB LPDDR4X, X16, 2133MHZ, -40C~
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BQ6NBHAHJ
Detailed Description
Package
100-VFBGA (10x7.5)
Key Features
Package: Tray; Package / Case: 100-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V; Memory Size: 2Gbit
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W66BQ6NBHAHJ Datasheet
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Technical Specifications
Winbond Electronics W66BQ6NBHAHJ DRAM technical specifications.
General
Max Frequency
2.133 GHz
Operating Temperature
-40°C ~ 105°C (TC)
Memory Interface
LVSTL_06
Memory Organization
128M x 16
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
100-VFBGA (10x7.5)
Access Time
3.6 ns
Write Cycle Time Word Page
18ns
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W66AP6NBHAFJWinbond ElectronicsPackage: Tray | Package / Case: 100-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 64 M x 16
W66AQ6NBHAHJWinbond ElectronicsPackage: Tray | Package / Case: 100-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 64 M x 16
W66BQ6NBHAGJWinbond ElectronicsPackage: Tray | Package / Case: 100-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 128 M x 16
W66AQ6NBHAGJWinbond ElectronicsPackage: Tray | Package / Case: 100-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 64 M x 16