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Winbond Electronics W66BQ6NBHAGJ DRAM

DRAM Memory IC 2Gbit LVSTL_06 1.867 GHz 1.06V ~ 1.17V, 1.7V ~ 1.95V 100-VFBGA (10x7.5)

In Stock ActiveWinbond Electronics100-VFBGA (10x7.5)
W66BQ6NBHAGJ - No Image Available

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W66BQ6NBHAGJ
Part Number (MPN)
W66BQ6NBHAGJ
Detailed Description
2GB LPDDR4X, X16, 1866MHZ, -40C~
Package
100-VFBGA (10x7.5)
Lifecycle Status
Active
Datasheet
PDF W66BQ6NBHAGJ Datasheet
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Technical Specifications

Winbond Electronics W66BQ6NBHAGJ DRAM technical specifications.

General

Memory Size
2Gbit
Maximum Clock Frequency
2.133 GHz
Package / Case
100-VFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V
Lifecycle Status
Active
Max Frequency
1.867 GHz
Memory Interface
LVSTL_06

Alternate Parts Comparison (W66BQ6NBHAGJ vs W632GU6RB-11 vs W9825G6KH-6 vs W9464G6KH-5)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface Mount--Surface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TC)--0 ~ 700°C ~ 70°C (TA)
Supply Voltage1.06V ~ 1.17V, 1.7V ~ 1.95V--3 ~ 3.62.3V ~ 2.7V
Memory Size2Gbit--256M64M
Lifecycle StatusActive--ActiveActive
Organization128 M x 16--16Mx164Mx16
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