Winbond Electronics W66BL6NBUAGI DRAM
DRAM Memory IC 2G LVSTL_11 1.866 GHz 1.1/1.8V WFBGA-200
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BL6NBUAGI
Detailed Description
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
Package
WFBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
W66BL6NBUAGI Datasheet
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Technical Specifications
Winbond Electronics W66BL6NBUAGI DRAM technical specifications.
General
Series
W66BL6NB
Interface
LVSTL_11
Memory Size
2G
Data Bus Width
16 bit
Maximum Clock Frequency
1.866 GHz
RoHS
Compliant
Number of Pins
200
Package / Case
WFBGA-200
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 95
Related Parts Comparison (W66BL6NBUAGI vs W971GG6JB-25 vs W631GG8NB-12 TR vs W94AD6KBHX5E TR)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Supply Voltage | 1.1/1.8 | 1.7 V ~ 1.9 V | 1.425V ~ 1.575V | 1.7V ~ 1.95V |
| Package / Case | WFBGA-200 | -- | 78-VFBGA | 60-TFBGA |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Operating Temperature | -40 ~ 95 | -- | 0°C ~ 95°C (TC) | -25°C ~ 85°C (TC) |
| Memory Size | 2G | -- | 1Gbit | 1Gbit |
| Lifecycle Status | Obsolete | -- | Active | Active |
| Memory Organization | -- | 64MX16 | 128M x 8 | 64M x 16 |
| Technology | -- | CMOS | SDRAM - DDR3 | SDRAM - Mobile LPDDR |
| Action |
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