Winbond Electronics W66BL6NBUAGI DRAM
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BL6NBUAGI
Detailed Description
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
Package
WFBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
W66BL6NBUAGI Datasheet
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Technical Specifications
Winbond Electronics W66BL6NBUAGI DRAM technical specifications.
General
Series
W66BL6NB
Interface
LVSTL_11
Memory Size
2G
Data Bus Width
16 bit
Maximum Clock Frequency
1.866 GHz
RoHS
Compliant
Number of Pins
200
Package / Case
WFBGA-200
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 95
Alternate Parts Comparison (W66BL6NBUAGI vs W971GG6JB-25 vs W631GG8NB-12 TR vs W94AD6KBHX5E TR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | WFBGA-200 | -- | 78-VFBGA | 60-TFBGA |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Operating Temperature | -40 ~ 95 | -- | 0°C ~ 95°C (TC) | -25°C ~ 85°C (TC) |
| Supply Voltage | 1.1/1.8 | -- | 1.425V ~ 1.575V | 1.7V ~ 1.95V |
| Memory Size | 2G | -- | 1Gbit | 1Gbit |
| Action |
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