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Winbond Electronics W632GG6MB-12 Memory ICs

IC DRAM 2GBIT PARALLEL 96VFBGA

1,266Winbond ElectronicsW632GG96-VFBGA$7.81
W632GG6MB-12 96-VFBGA package illustration

Same model may have multiple batches, images only for reference.

W632GG6MB-12
Part Number (MPN)
W632GG6MB-12
Base Model
Detailed Description
IC DRAM 2GBIT PARALLEL 96VFBGA
Package
96-VFBGA
Lifecycle Status
Obsolete
Datasheet
PDF W632GG6MB-12 Datasheet
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Ordering Code Family

W632GG groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

5 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W632GG6MB-12 Memory ICs technical specifications.

General

Series
W632GG6MB
Memory Size
2Gb (128M x 16)
Data Bus Width
16 bit
Maximum Clock Frequency
800 MHz
RoHS
ROHS3 Compliant
Package / Case
96-VFBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 95°C (TC)
Supply Voltage
1.425V ~ 1.575V
Lifecycle Status
Obsolete

Alternate Parts Comparison (W632GG6MB-12 vs W632GG6NB12I vs W632GG8NB-12 vs W632GG6NB09I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesW632GG6MBW632GG6NBW632GG8NBW632GG6NB
Package / Case96-VFBGA96-VFBGA78-VFBGA96-VFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 95°C (TC)-40°C ~ 95°C (TC)0°C ~ 95°C (TC)-40°C ~ 95°C (TC)
Supply Voltage1.425V ~ 1.575V1.425V ~ 1.575V1.425V ~ 1.575V1.425V ~ 1.575V
Memory Size2Gb (128M x 16)2Gbit2Gbit2Gbit
Data Bus Width16 bit16 bit8 bit16 bit
RoHSROHS3 CompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusObsoleteActiveActiveActive
Access Time20 ns20 ns20 ns20 ns
Clock Frequency800 MHz800 MHz800 MHz1.067 GHz
Max Frequency800 MHz800 MHz800 MHz1.067 GHz
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