Winbond Electronics W29N02GZBIBF Integrated Circuits (ICs)
IC FLASH 2GBIT PARALLEL 63VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N02GZBIBF
Category
Integrated Circuits (ICs)Winbond Electronics W29N02GZBIBF
Detailed Description
Package
--
Lifecycle Status
Unknown
RoHS State
Unknown
Datasheet
W29N02GZBIBF Datasheet
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Technical Specifications
Winbond Electronics W29N02GZBIBF Integrated Circuits (ICs) technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA) Memory Interface: Parallel Memory Organization: 256M x 8 Mounting Type: Surface Mount Memory Type: Non-Volatile Product Status: Active Supplier Device Package: 63-VFBGA (9x11) Access Time: 25 ns Write Cycle Time
Word Page
35ns Memory Size: 2Gbit Package / Case: 63-VFBGA Technology: FLASH
Supply
1.7V ~ 1.95V Package: Tray Memory Format: FLASH
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ATTINY1616-MNMicrochip TechnologyProgram Memory Type: Flash PCB changed: 20 ECCN (US): EAR99 DAC Resolution (bit): 8/8/8 Maximum Expanded Memory Size: 64KB PPAP: No Data Bus Width (bit): 8 Device Core: AVR SPI: 1 Automotive: No ADC Channels: 20/20 Minimum Operating Temperature (°C): -40 Maximum Operating Temperature (°C): 105 Supplier Package: VQFN EP No. of Timers: 4 Instruction Set Architecture: RISC Core Architecture: AVR Package Height: 0.82 Family Name: ATtiny Maximum Operating Supply Voltage (V): 5.5 Maximum Clock Rate (M