Winbond Electronics W29N01HZDINA Flash Memory
IC FLASH 1GBIT PARALLEL 48VFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N01HZDINA
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 48-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 1G; Interface: Parallel
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N01HZDINA Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
COMPONENTS
Automotive
No
Ppap
No
Cell Type
SLC NAND
Memory Size
1G
Architecture
Sectored
Boot Block
No
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25Q128JVCIQWinbond ElectronicsPackage: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 128M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 24
W29GL128CH9CWinbond ElectronicsPackage: BGA | Package / Case: 56-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 128M | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 56
W71NW20GD3DWWinbond ElectronicsPackage: BGA | Package / Case: 130-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2Gb (NAND), 1Gb (LPDDR) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 130 | Organization: 16Mx8 Flash + 2Mx32 DDR DRAM
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 32M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 24