Winbond Electronics W25Q32JVTCIM Flash Memory
IC FLASH 32MBIT SPI/QUAD 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q32JVTCIM
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 32M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W25Q32JVTCIM Datasheet
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Technical Specifications
Winbond Electronics W25Q32JVTCIM Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991b.1.a.
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
32M
Architecture
Sectored
Boot Block
Yes
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