Winbond Electronics W25Q128JVCIQ Flash Memory
IC FLASH 128MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q128JVCIQ
Series
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 128M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25Q128JVCIQ Flash Memory technical specifications.
General
RoHS
Compliant
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Winbond Electronics
Source Category
Integrated Circuits (ICs) > Memory > Unclassified Memory
Stock
26792
Extracted Price
0.7599
Price Formula
winsource min price * 2
ECCN
3A991.b.1.a
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W25Q128JVSIQTRWinbond ElectronicsPackage: Reel | Package / Case: SOIC-8 | Memory Size: 128 Mbit | Interface: SPI | Organization: 16 M x 8
W25Q128FVPIQWinbond ElectronicsPackage: Tube | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)