Winbond Electronics W29GL128CH9C Flash Memory
IC FLASH 128MBIT PAR 56TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29GL128CH9C
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 56-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 128M; Interface: Parallel
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
W29GL128CH9C Datasheet
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Technical Specifications
Winbond Electronics W29GL128CH9C Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Obsolete
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
128M
Architecture
Sectored
Boot Block
Yes
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