Winbond Electronics W29GL128CH9C Flash Memory
IC FLASH 128MBIT PAR 56TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29GL128CH9C
Detailed Description
IC FLASH 128MBIT PAR 56TFBGA
Package
BGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
W29GL128CH9C Datasheet
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Technical Specifications
Winbond Electronics W29GL128CH9C Flash Memory technical specifications.
General
Interface
Parallel
Memory Size
128M
RoHS
Compliant
Number of Pins
56
Package / Case
56-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3/3.3
Lifecycle Status
Obsolete
Automotive
No
Alternate Parts Comparison (W29GL128CH9C vs W35N04JWTBIC vs W71NW20GD3DW vs W25Q32JVTBIQ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Number of Pins | 56 | 24 | 130 | 24 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Obsolete | Active | Active | Active |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.85(Max) | 0.85 | 0.68 | 0.85 |
| Package Length | 9 | 8 | 9 | 8 |
| Package Width | 7 | 6 | 8 | 6 |
| Supplier Package | TFBGA | TFBGA | VFBGA | TFBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -- | -40°C ~ 85°C (TA) | -40 ~ 85 |
| Supply Voltage | 3/3.3 | -- | 1.7V ~ 1.95V | 3/3.3 |
| Memory Size | 128M | -- | 2Gb (NAND), 1Gb (LPDDR) | 32M |
| Action |
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