Winbond Electronics W29N01HWBINF Flash Memory
IC FLASH 1GBIT PARALLEL 63VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N01HWBINF
Detailed Description
IC FLASH 1GBIT PARALLEL 63VFBGA
Package
VFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W29N01HWBINF Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N01HWBINF Flash Memory technical specifications.
General
Memory Size
1Gb (128M x 8)
RoHS
Compliant
Number of Pins
63
Package / Case
63-VFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Active
Automotive
No
Ppap
No
Alternate Parts Comparison (W29N01HWBINF vs W25Q128JVSIQTR vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 63-VFBGA | SOIC-8 | SOIC-8 | SOIC-8 |
| Mounting Type | Surface Mount | SMD/SMT | SMD/SMT | SMD/SMT |
| Operating Temperature | -40°C ~ 85°C (TA) | - 40°C ~ + 85°C | - 40°C ~ + 85°C | - 40°C ~ + 85°C |
| Supply Voltage | 1.7V ~ 1.95V | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V |
| Memory Size | 1Gb (128M x 8) | 128 Mbit | 64 Mbit | 64 Mbit |
| Series | -- | W25Q128JV | W25Q64JV | W25Q64JV |
| Interface | -- | SPI | SPI | SPI |
| Maximum Clock Frequency | -- | 133 MHz | 133 MHz | 133 MHz |
| Data Bus Width | -- | 8 bit | 8 bit | 8 bit |
| Active Read Current Max | -- | 25 mA | 25 mA | 25 mA |
| Moisture Sensitive | -- | Yes | Yes | Yes |
| Organization | -- | 16 M x 8 | 8 M x 8 | 8 M x 8 |
| Action |
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