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Winbond Electronics W25X40CLZPIG Memory ICs

IC FLASH 4MBIT SPI 104MHZ 8WSON

100 ActiveWinbond ElectronicsW25X8-WDFN Exposed Pad$3.26
W25X40CLZPIG - No Image Available

Same model may have multiple batches, images only for reference.

W25X40CLZPIG
Part Number (MPN)
W25X40CLZPIG
Base Model
Detailed Description
IC FLASH 4MBIT SPI 104MHZ 8WSON
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
PDF W25X40CLZPIG Datasheet
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Ordering Code Family

W25X groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

4 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W25X40CLZPIG Memory ICs technical specifications.

General

Interface
Serial (SPI, Dual SPI)
Memory Size
4Mb (512K x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.3V ~ 3.6V
Lifecycle Status
LTB
Package
8-WDFN Exposed Pad

Alternate Parts Comparison (W25X40CLZPIG vs W25X20AVSNIG vs W25X32VSSIG vs W25X40BVSSIG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-WDFN Exposed Pad8-SOIC8-SOIC8-SOIC
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.3V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V
Memory Size4Mb (512K x 8)2 Mbit32 Mbit4 Mbit
RoHSCompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusLTBObsoleteObsoleteObsolete
Max Frequency104 MHz100 MHz75 MHz104 MHz
Memory FormatFlashFLASHFLASHFLASH
Memory InterfaceSPISPISPISPI
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyFlashFLASHFLASHFLASH
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