Winbond Electronics W25Q256JWBIQ Flash Memory
IC FLASH 256MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q256JWBIQ
Detailed Description
IC FLASH 256MBIT SPI 24TFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25Q256JWBIQ Datasheet
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Technical Specifications
Winbond Electronics W25Q256JWBIQ Flash Memory technical specifications.
General
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
256M
RoHS
Compliant
Number of Pins
24
Package / Case
24-TBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8
Lifecycle Status
Active
Automotive
No
Alternate Parts Comparison (W25Q256JWBIQ vs W71NW20GD3DW vs W25Q32JVTBIQ vs W29N04GZBIBA)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40 ~ 85 | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8 | 1.7V ~ 1.95V | 3/3.3 | 1.8 |
| Memory Size | 256M | 2Gb (NAND), 1Gb (LPDDR) | 32M | 4G |
| Number of Pins | 24 | 130 | 24 | 63 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Active |
| Automotive | No | No | No | Yes |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.85 | 0.68 | 0.85 | 0.6(Max) |
| Package Length | 8 | 9 | 8 | 11 |
| Package Width | 6 | 8 | 6 | 9 |
| Action |
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