Winbond Electronics W25Q02NWTBIM Flash Memory
SPIFLASH, 2G-BIT, 4KB UNIFORM SE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q02NWTBIM
Detailed Description
SPIFLASH, 2G-BIT, 4KB UNIFORM SE
Package
TFBGA
Key Features
Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25Q02NWTBIM Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q02NWTBIM Flash Memory technical specifications.
General
RoHS
Compliant
Number of Pins
24
Mounting Type
Surface Mount
Lifecycle Status
Active
Package Height
0.85
Package Width
6
Package Length
8
Supplier Package
TFBGA
Alternate Parts Comparison (W25Q02NWTBIM vs W25Q128JVSIQTR vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | SMD/SMT | SMD/SMT | SMD/SMT |
| Number of Pins | 24 | -- | -- | -- |
| RoHS | Compliant | -- | -- | -- |
| Lifecycle Status | Active | -- | -- | -- |
| Package Height | 0.85 | -- | -- | -- |
| Package Length | 8 | -- | -- | -- |
| Package Width | 6 | -- | -- | -- |
| Supplier Package | TFBGA | -- | -- | -- |
| Series | -- | W25Q128JV | W25Q64JV | W25Q64JV |
| Package / Case | -- | SOIC-8 | SOIC-8 | SOIC-8 |
| Operating Temperature | -- | - 40°C ~ + 85°C | - 40°C ~ + 85°C | - 40°C ~ + 85°C |
| Supply Voltage | -- | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V | 2.7 V ~ 3.6 V |
| Action |
More Parts in Flash Memory
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.