Winbond Electronics W25Q01NWTBIQ Flash Memory
IC FLASH 1GBIT SPI/QUAD 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q01NWTBIQ
Detailed Description
IC FLASH 1GBIT SPI/QUAD 24TFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25Q01NWTBIQ Datasheet
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Technical Specifications
Winbond Electronics W25Q01NWTBIQ Flash Memory technical specifications.
General
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
1G
RoHS
Compliant
Number of Pins
24
Package / Case
24-TBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8
Lifecycle Status
Active
Automotive
No
Alternate Parts Comparison (W25Q01NWTBIQ vs W71NW20GD3DW vs W25Q32JVTBIQ vs W29N04GZBIBA)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40 ~ 85 | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8 | 1.7V ~ 1.95V | 3/3.3 | 1.8 |
| Memory Size | 1G | 2Gb (NAND), 1Gb (LPDDR) | 32M | 4G |
| Number of Pins | 24 | 130 | 24 | 63 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Active |
| Automotive | No | No | No | Yes |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.85 | 0.68 | 0.85 | 0.6(Max) |
| Package Length | 8 | 9 | 8 | 11 |
| Package Width | 6 | 8 | 6 | 9 |
| Action |
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