Winbond Electronics W25N04KWZEIU Flash Memory
4G-BIT SERIAL NAND FLASH, 1.8V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25N04KWZEIU
Series
Detailed Description
4G-BIT SERIAL NAND FLASH, 1.8V
Package
WSON EP
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25N04KWZEIU Datasheet
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Technical Specifications
Winbond Electronics W25N04KWZEIU Flash Memory technical specifications.
General
Series
SpiFlash®
Memory Size
4Gbit
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Active
Package Height
0.73
Alternate Parts Comparison (W25N04KWZEIU vs W25Q128JVSIQTR vs W25N01GWZEIG vs W25Q128JVFIQ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | SMD/SMT | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | - 40°C ~ + 85°C | -40 ~ 85 | -40 ~ 85 |
| Supply Voltage | 1.7V ~ 1.95V | 2.7 V ~ 3.6 V | 1.8 | 3/3.3 |
| Memory Size | 4Gbit | 128 Mbit | 1G | 128M |
| Number of Pins | 8 | -- | 8 | 16 |
| RoHS | Compliant | -- | Compliant | Compliant |
| Lifecycle Status | Active | -- | LTB | Active |
| Package Height | 0.73 | -- | 0.73 | 2.31 mm |
| Package Length | 6 | -- | 6 | 10.31 mm |
| Package Width | 8 | -- | 8 | 7.49 mm |
| Supplier Package | WSON EP | -- | WSON EP | SOIC W |
| Interface | -- | SPI | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) |
| Action |
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