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Winbond Electronics W25N01GVZEIG/TRAY Flash Memory

Flash Memory IC 1G Serial (SPI, Dual SPI, Quad SPI) 104 MHz 3/3.3V

In StockWinbond ElectronicsSpiFlash®SONRoHS
W25N01GVZEIG/TRAY SON package illustration

Same model may have multiple batches, images only for reference.

W25N01GVZEIG/TRAY
Part Number (MPN)
W25N01GVZEIG/TRAY
Detailed Description
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 8-Pin WSON EP Tray
Package
SON
Lifecycle Status
LTB
RoHS State
RoHS Compliant
Datasheet
PDF W25N01GVZEIG/TRAY Datasheet
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Technical Specifications

Winbond Electronics W25N01GVZEIG/TRAY Flash Memory technical specifications.

General

Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
1G
RoHS
Compliant
Number of Pins
8
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 85
Supply Voltage
3/3.3
Lifecycle Status
LTB
Automotive
No
PPAP
No

Related Parts Comparison (W25N01GVZEIG/TRAY vs W25Q128JVFIQ TR vs W25Q128JWPIM TR vs W25Q128JVSIQTR)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSMD/SMT
Operating Temperature-40 ~ 85-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)- 40°C ~ + 85°C
Supply Voltage3/3.32.7V ~ 3.6V1.7V ~ 1.95V2.7 V ~ 3.6 V
Memory Size1G128 Mbit128 Mbit128 Mbit
Lifecycle StatusLTBActiveActive--
Max Frequency104133 MHz133 MHz--
Series--SpiFlash®SpiFlash®W25Q128JV
Package / Case--16-SOIC8-WDFN Exposed PadSOIC-8
Memory Organization--16M x 816M x 816 M x 8
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