Winbond Electronics W25M512JVFIQ Memory ICs
IC FLASH 512MBIT SPI 16SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25M512JVFIQ
Base Model
Detailed Description
Package
16-SOIC (0.295", 7.50mm Width)
Key Features
Package: 16-SOIC (0.295", 7.50mm Width); Supply Voltage: 2.7V ~ 3.6V; Memory Size: 512Mb (64M x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W25M512JVFIQ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25M512JVFIQ Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
16-SOIC (0.295", 7.50mm Width)
Technology
FLASH - NOR
Supplier Device Package
16-SOIC
Memory Size
512Mb (64M x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
104 MHz
Memory Format
Flash
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25M161AVEITWinbond ElectronicsPackage / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 1G NAND+16M NOR | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8
W25M02GVTCIGWinbond ElectronicsPackage: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 85°C (TA)