Winbond Electronics W25M512JVEIQ Memory ICs
IC FLSH 512MBIT SPI 104MHZ 8WSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25M512JVEIQ
Base Model
Detailed Description
Package
8-WDFN Exposed Pad
Key Features
Package: 8-WDFN Exposed Pad; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 512Mb (64M x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W25M512JVEIQ Datasheet
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Technical Specifications
Winbond Electronics W25M512JVEIQ Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
8-WDFN Exposed Pad
Technology
FLASH - NOR
Supplier Device Package
8-WSON (8x6)
Memory Size
512Mb (64M x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
104 MHz
Memory Format
Flash
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W25M02GVTCIGWinbond ElectronicsPackage: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 85°C (TA)