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Winbond Electronics W25M512JVEIQ Memory ICs

IC FLSH 512MBIT SPI 104MHZ 8WSON

2 ActiveWinbond ElectronicsW25M8-WDFN Exposed Pad$15.85
W25M512JVEIQ - No Image Available

Same model may have multiple batches, images only for reference.

W25M512JVEIQ
Part Number (MPN)
W25M512JVEIQ
Base Model
Detailed Description
IC FLSH 512MBIT SPI 104MHZ 8WSON
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
PDF W25M512JVEIQ Datasheet
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Ordering Code Family

W25M groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

3 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W25M512JVEIQ Memory ICs technical specifications.

General

Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
512Mb (64M x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Package
8-WDFN Exposed Pad

Alternate Parts Comparison (W25M512JVEIQ vs W25M02GVTCIG vs W25M02GVTBIG vs W25M02GVZEJG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-WDFN Exposed Pad24-TBGA24-TBGA8-WDFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)
Supply Voltage2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V
Memory Size512Mb (64M x 8)2Gbit2Gbit2Gbit
RoHSCompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusActiveActiveActiveObsolete
Max Frequency104 MHz104 MHz104 MHz104 MHz
Memory FormatFlashFLASHFLASHFLASH
Memory InterfaceSPISPI - Quad I/OSPI - Quad I/OSPI - Quad I/O
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyFLASH - NORFLASH - NAND (SLC)FLASH - NAND (SLC)FLASH - NAND (SLC)
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