Winbond Electronics W25M02GVZEIG Memory ICs
2G-BIT SERIAL NAND FLASH, 3V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25M02GVZEIG
Base Model
Detailed Description
2G-BIT SERIAL NAND FLASH, 3V
Package
8-WDFN Exposed Pad
Lifecycle Status
Obsolete
Datasheet
W25M02GVZEIG Datasheet
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Technical Specifications
Winbond Electronics W25M02GVZEIG Memory ICs technical specifications.
General
Manufacturer
Winbond Electronics
Series
SpiFlash®
Memory Size
2Gb (256M x 8)
RoHS
ROHS3 Compliant
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Obsolete
Package
8-WDFN Exposed Pad
Alternate Parts Comparison (W25M02GVZEIG vs W25M512JVEIQ vs W25M512JVBIQ vs W25M512JVFIQ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad | 24-TBGA | 16-SOIC |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 3/3.3 | 2.7V ~ 3.6V |
| Memory Size | 2Gb (256M x 8) | 512Mb (64M x 8) | 512M | 512Mb (64M x 8) |
| RoHS | ROHS3 Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Obsolete | Active | Active | Active |
| Max Frequency | 104 MHz | 104 MHz | 104 | 104 MHz |
| Memory Format | Flash | Flash | Flash | Flash |
| Memory Interface | SPI - Quad I/O | SPI | SPI | SPI |
| Memory Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Package | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad | BGA | 16-SOIC (0.295", 7.50mm Width) |
| Action |
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