Winbond Electronics W25M02GWZEIG Flash Memory
IC FLASH 2GBIT SPI/QUAD 8WSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25M02GWZEIG
Detailed Description
Package
SON
Key Features
Package: SON; Package / Case: 8-WDFN Exposed Pad; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 2G; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25M02GWZEIG Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991b.1.a.
Lifecycle Status
Obsolete
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
SLC NAND
Memory Size
2G
Architecture
Sectored
Boot Block
No
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