Vishay SI3865DDV-T1-GE3 Microcontrollers
Power Switch Hi Side 1-OUT 2.8A 0.11Ohm 6-Pin TSOP T/R
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
SI3865DDV-T1-GE3
Detailed Description
Power Switch Hi Side 1-OUT 2.8A 0.11Ohm 6-Pin TSOP T/R
Package
SOT-23-6 Thin, TSOT-23-6
Lifecycle Status
Active
Datasheet
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Technical Specifications
Vishay SI3865DDV-T1-GE3 Microcontrollers technical specifications.
General
Series
SI3865DDV
Interface
On/Off
RoHS
Yes
Package / Case
SOT-23-6 Thin, TSOT-23-6
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 150°C (TJ)
Supply Voltage
1.5 V ~ 12 V
Lifecycle Status
Active
Features
Slew Rate Controlled
Output Type
P-Channel
Alternate Parts Comparison (SI3865DDV-T1-GE3 vs DG468DV-T1-E3 vs DG447DV-T1-E3 vs DG467DV-T1-E3)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | SOT-23-6 Thin, TSOT-23-6 | SOT-23-6 Thin, TSOT-23-6 | SOT-23-6 Thin, TSOT-23-6 |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -55°C ~ 150°C (TJ) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Lifecycle Status | Active | Active | Active | Active |
| Channel Capacitance Cs Off Cd Off | -- | 30pF, 15pF | 19pF, 8pF | 30pF, 15pF |
| Charge Injection | -- | 21pC | 10pC | 21pC |
| Current Leakage Is Off Max | -- | 1nA | 1nA | 1nA |
| Multiplexer Demultiplexer Circuit | -- | 1:1 | 1:1 | 1:1 |
| Number of Circuits | -- | 1 | 1 | 1 |
| On State Resistance Max | -- | 9Ohm | 25Ohm | 9Ohm |
| Switch Circuit | -- | SPST - NO | SPST - NC | SPST - NC |
| Switch Time Ton Toff Max | -- | 140ns, 80ns | 130ns, 95ns | 140ns, 80ns |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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