Texas Instruments XOMAPL137AZKBT3 Microcontroller, Microprocessor, FPGA Modules
IC MPU OMAP-L1X 300MHZ 256BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XOMAPL137AZKBT3
Detailed Description
IC MPU OMAP-L1X 300MHZ 256BGA
Package
256-BGA
Key Features
Package / Case: 256-BGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
XOMAPL137AZKBT3 Datasheet
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Technical Specifications
Texas Instruments XOMAPL137AZKBT3 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Package / Case
256-BGA
Operating Temperature
-40°C ~ 125°C (TJ)
Voltage IO
1.8V, 3.3V
Speed
300MHz
Core Processor
ARM926EJ-S
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Signal Processing; C674x, System Control; CP15
RAM Controllers
SDRAM
Graphics Acceleration
No
Display and Interface Controllers
LCD
Alternate Parts Comparison (XOMAPL137AZKBT3 vs TMS320C6211BZFN167 vs TMS320C28343ZFEQ vs TMS320C6211BGFN150)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 256-BGA | 256-BGA | 256-BGA | 256-BGA |
| Operating Temperature | -40°C ~ 125°C (TJ) | 0°C ~ 90°C (TC) | -40°C ~ 125°C (TJ) | 0°C ~ 90°C (TC) |
| Voltage IO | 1.8V, 3.3V | 3.30V | 3.30V | 3.30V |
| Mounting Type | -- | Surface Mount | Surface Mount | Surface Mount |
| Interface | -- | Host Interface, McBSP | CAN, EBI/EMI, I²C, McBSP, SCI, SPI | Host Interface, McBSP |
| Clock Rate | -- | 167MHz | 200MHz | 150MHz |
| Non Volatile Memory | -- | External | ROM (16kB) | External |
| On Chip RAM | -- | 72kB | 260kB | 72kB |
| Type | -- | Fixed Point | Floating Point | Fixed Point |
| Voltage Core | -- | 1.80V | 1.10V | 1.80V |
| Action |
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