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Texas Instruments TMS5701224CZWTQQ1 Microcontrollers

32-Bit RISC Flash MCU, Cortex-R4F, 125°C, 337-NFBGA

9,000 ActiveTexas Instruments337-LFBGA$38.35
TMS5701224CZWTQQ1 337-LFBGA package illustration

Same model may have multiple batches, images only for reference.

TMS5701224CZWTQQ1
Manufacturer
Part Number (MPN)
TMS5701224CZWTQQ1
Detailed Description
32-Bit RISC Flash MCU, Cortex-R4F, 125°C, 337-NFBGA
Package
337-LFBGA
Lifecycle Status
Active
Datasheet
PDF TMS5701224CZWTQQ1 Datasheet
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Technical Specifications

Texas Instruments TMS5701224CZWTQQ1 Microcontrollers technical specifications.

General

RAM Size
192K x 8
Package / Case
337-LFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.14V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
101
Speed
180MHz
EEPROM Size
64K x 8

Related Parts Comparison (TMS5701224CZWTQQ1 vs TMS320DM355CZCEA21 vs TMS320DM355DZCE216 vs TMS320F28374SZWTTR)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case337-LFBGA337-LFBGA337-LFBGA337-LFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 100°C (TC)0°C ~ 85°C (TC)-40°C ~ 105°C (TJ)
Lifecycle StatusActiveActiveNot For New DesignsActive
Supply Voltage1.14V ~ 3.6V----1.14V ~ 3.47V
Core ProcessorARM® Cortex®-R4F----C28x
Core Size16/32-Bit----32-Bit Single-Core
RAM Size192K x 8----66K x 16
ConnectivityCANbus, EBI/EMI, I²C, LINbus, MibSPI, SCI, SPI, UART/USART----CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB
Data ConvertersA/D 24x12b----A/D 24x12b; D/A 3x12b
Number of I/O101----169
Oscillator TypeExternal----Internal
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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