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Texas Instruments TMS320DM335CZCE135 DSPs (Digital Signal Processors)

IC DIGITAL MEDIA SOC 337-NFBGA

In StockTexas InstrumentsTMS320TMS320DMNFBGARoHS
TMS320DM335CZCE135 NFBGA package illustration

Same model may have multiple batches, images only for reference.

TMS320DM335CZCE135
Manufacturer
Part Number (MPN)
TMS320DM335CZCE135
Series
Base Model
Detailed Description
The TMS320DM335CZCE135 is a 337-pin Ball Grid Array digital signal processor from Texas Instruments. It features a plastic package with a seated plane height of 1.3mm and a pin pitch of 0.65mm. The processor is designed for surface mount applications and has a package length, width, and height of 13mm, 13mm, and 0.89mm, respectively. The device is suitable for use in a variety of applications, including those with high pin counts and complex digital signal processing requirements.
Package
NFBGA
Key Features
Package: NFBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF TMS320DM335CZCE135 Datasheet
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Ordering Code Family

TMS320DM groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

100 ordering variants listed on the family page.

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Technical Specifications

Texas Instruments TMS320DM335CZCE135 DSPs (Digital Signal Processors) technical specifications.

General

Interface
ASP, EBI/EMI, I²C, SPI, UART, USB
RoHS
Yes
Number of Pins
337
Package / Case
337-LFBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TC)
Lifecycle Status
Obsolete
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
NFBGA

Alternate Parts Comparison (TMS320DM335CZCE135 vs TMS320DM6446BZWT8 vs TMS320DM648CUT7 vs TMS320DM355CZCE216)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case337-LFBGA361-LFBGA529-BFBGA337-LFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TC)0°C ~ 85°C (TC)0°C ~ 90°C (TC)0°C ~ 85°C (TC)
InterfaceASP, EBI/EMI, I²C, SPI, UART, USBASP, EBI/EMI, Host Interface, I²C, SPI, UART, USBHost Interface, I²C, McASP, PCI, SPI, UARTASP, I²C, SPI, UART, USB
Lifecycle StatusObsoleteNot For New DesignsNot For New DesignsActive
Clock Rate135MHz810MHz DSP, 405MHz ARM®720MHz216MHz
Non Volatile MemoryROM (8kB)ROM (8kB)ROM (64kB)ROM (8kB)
On Chip RAM56kB160kB576kB56kB
TypeDigital Media System-on-Chip (DMSoC)Digital Media System-on-Chip (DMSoC)Fixed PointDigital Media System-on-Chip (DMSoC)
Voltage Core1.30V1.30V1.20V1.30V
Voltage IO1.8V, 3.3V1.8V, 3.3V1.8V, 3.3V1.8V, 3.3V
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Texas Instruments TMS320DM335CZCE135 DSPs (Digital Signal Processors) Overview

The TMS320DM335CZCE135 is a 337-pin Ball Grid Array digital signal processor from Texas Instruments. It features a plastic package with a seated plane height of 1.3mm and a pin pitch of 0.65mm. The processor is designed for surface mount applications and has a package length, width, and height of 13mm, 13mm, and 0.89mm, respectively.

The device is suitable for use in a variety of applications, including those with high pin counts and complex digital signal processing requirements.

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