Texas Instruments TLV9004IRUCR Microcontrollers
4-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 14-QFN -40 to 125
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TLV9004IRUCR
Detailed Description
4-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems 14-QFN -40 to 125
Package
14-XFQFN
Lifecycle Status
Active
Datasheet
TLV9004IRUCR Datasheet
Quick Jump:
Technical Specifications
Texas Instruments TLV9004IRUCR Microcontrollers technical specifications.
General
Package / Case
14-XFQFN
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Lifecycle Status
Active
Current Supply
60µA
Output Type
Rail-to-Rail
Number of Circuits
4
Amplifier Type
General Purpose
Current Output Channel
40 mA
Slew Rate
2V/µs
Related Parts Comparison (TLV9004IRUCR vs TLV5623CD vs TLV3401IDBVR vs TLV2241IDBVT)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 14-XFQFN | 8-SOIC | SC-74A, SOT-753 | SC-74A, SOT-753 |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | 0°C ~ 70°C | -40°C ~ 125°C | -40°C ~ 85°C |
| Lifecycle Status | Active | Active | Active | Active |
| Output Type | Rail-to-Rail | Voltage | CMOS, Open-Drain | Rail-to-Rail |
| Supply Voltage | -- | 3V | 2.7V ~ 16V | 6V |
| Number of Channels | -- | 1 | 1 | 1 |
| Height | -- | 1.58mm | 1.45mm | 1.15mm |
| Lead Free | -- | Lead Free | Lead Free | Lead Free |
| Length | -- | 4.9mm | 2.9mm | 2.9mm |
| Package | -- | D | SOT-23 | SOT-23 |
| Package Quantity | -- | 75 | 1 | 250 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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