Texas Instruments TDA4VM88TGBALFR System On Chip (SoC)
NEXT GENERATION SOC FAMILY FOR L
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TDA4VM88TGBALFR
Detailed Description
NEXT GENERATION SOC FAMILY FOR L
Package
827-BFBGA, FCBGA
Key Features
Package / Case: 827-BFBGA, FCBGA
Lifecycle Status
Active
Datasheet
TDA4VM88TGBALFR Datasheet
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Technical Specifications
Texas Instruments TDA4VM88TGBALFR System On Chip (SoC) technical specifications.
General
RAM Size
1.5MB
Package / Case
827-BFBGA, FCBGA
Operating Temperature
-40°C ~ 105°C (TJ)
Peripherals
DMA, PWM, WDT
Architecture
DSP, MCU, MPU
Speed
2GHz, 1GHz, 1.35GHz, 1GHz
Core Processor
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity
MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
Alternate Parts Comparison (TDA4VM88TGBALFR vs TDA2EGBHQCBDRQ1 vs TDA2SGBRQABCRQ1 vs TDA4VL21HGAALZRQ1)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 827-BFBGA, FCBGA | 538-LFBGA, FCBGA | 760-BFBGA, FCBGA | 770-BFBGA, FCBGA |
| Operating Temperature | -40°C ~ 105°C (TJ) | -- | -- | -40°C ~ 125°C (TJ) |
| Core Processor | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | -- | -- | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x |
| RAM Size | 1.5MB | -- | -- | 1.5MB |
| Architecture | DSP, MCU, MPU | -- | -- | DSP, MCU, MPU |
| Connectivity | MCAN, MMC/SDSD/IOI²C, SPI, UART, USB | -- | -- | MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB |
| Peripherals | DMA, PWM, WDT | -- | -- | DMA, PWM, WDT |
| Speed | 2GHz, 1GHz, 1.35GHz, 1GHz | -- | -- | 2GHz, 1GHz, 1GHz |
| Mounting Type | -- | Surface Mount | Surface Mount | -- |
| Type | -- | Advanced Driver Assistance Systems | Advanced Driver Assistance Systems | -- |
| Action |
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