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Texas Instruments TDA4VL21HGAALZRQ1 System On Chip (SoC)

Automotive system-on-a-chip with AI, graphics for surround view, and park-assist applications

1,744 ActiveTexas Instruments770-BFBGA, FCBGARoHS
TDA4VL21HGAALZRQ1 - No Image Available

Same model may have multiple batches, images only for reference.

TDA4VL21HGAALZRQ1
Manufacturer
Part Number (MPN)
TDA4VL21HGAALZRQ1
Detailed Description
Automotive system-on-a-chip with AI, graphics for surround view, and park-assist applications
Package
770-BFBGA, FCBGA
Key Features
Package / Case: 770-BFBGA, FCBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF TDA4VL21HGAALZRQ1 Datasheet
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Technical Specifications

Texas Instruments TDA4VL21HGAALZRQ1 System On Chip (SoC) technical specifications.

General

Series
Automotive, AEC-Q100
RAM Size
1.5MB
Package / Case
770-BFBGA, FCBGA
Operating Temperature
-40°C ~ 125°C (TJ)
Peripherals
DMA, PWM, WDT
Architecture
DSP, MCU, MPU
Number of I/O
155
Speed
2GHz, 1GHz, 1GHz
Core Processor
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity
MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB

Alternate Parts Comparison (TDA4VL21HGAALZRQ1 vs TDA2EGBHQCBDRQ1 vs TDA2SGBRQABCRQ1 vs TDA2HGBRQABCRQ1)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case770-BFBGA, FCBGA538-LFBGA, FCBGA760-BFBGA, FCBGA760-BFBGA, FCBGA
SeriesAutomotive, AEC-Q100------
Operating Temperature-40°C ~ 125°C (TJ)------
Core ProcessorARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x------
RAM Size1.5MB------
ArchitectureDSP, MCU, MPU------
ConnectivityMCAN, MMC/SD/SDIO, I²C, SPI, UART, USB------
Number of I/O155------
PeripheralsDMA, PWM, WDT------
Speed2GHz, 1GHz, 1GHz------
Mounting Type--Surface MountSurface MountSurface Mount
Type--Advanced Driver Assistance SystemsAdvanced Driver Assistance SystemsAdvanced Driver Assistance Systems
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