Texas Instruments DRA829VMTGBALF System On Chip (SoC)
PROTOTYPE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DRA829VMTGBALF
Detailed Description
Package
827-BFBGA, FCBGA
Key Features
Package / Case: 827-BFBGA, FCBGA
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
DRA829VMTGBALF Datasheet
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Technical Specifications
Texas Instruments DRA829VMTGBALF System On Chip (SoC) technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TJ)
Package / Case
827-BFBGA, FCBGA
Supplier Device Package
827-FCBGA (24x24)
Peripherals
DMA, PWM, WDT
Architecture
DSP, MCU, MPU
Number of I/O
226
Speed
2GHz, 1GHz, 1.35GHz, 1GHz
Core Processor
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
RAM Size
1.5MB
Connectivity
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
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