Texas Instruments TDA3MVRBFABFRQ1 System On Chip (SoC)
IC SOC PROCESSOR
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TDA3MVRBFABFRQ1
Detailed Description
IC SOC PROCESSOR
Package
367-BFBGA, FCBGA
Key Features
Package / Case: 367-BFBGA, FCBGA
Lifecycle Status
Active
Datasheet
TDA3MVRBFABFRQ1 Datasheet
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Technical Specifications
Texas Instruments TDA3MVRBFABFRQ1 System On Chip (SoC) technical specifications.
General
RAM Size
512KB
Package / Case
367-BFBGA, FCBGA
Operating Temperature
-40°C ~ 125°C (TJ)
Peripherals
DMA, PWM, WDT
Architecture
DSP, MPU
Speed
212.8MHz, 745MHz
Core Processor
ARM® Cortex®-M4, C66x
Connectivity
CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
Alternate Parts Comparison (TDA3MVRBFABFRQ1 vs TDA2EGBHQCBDRQ1 vs TDA2SGBRQABCRQ1 vs TDA2HGBRQABCRQ1)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 367-BFBGA, FCBGA | 538-LFBGA, FCBGA | 760-BFBGA, FCBGA | 760-BFBGA, FCBGA |
| Operating Temperature | -40°C ~ 125°C (TJ) | -- | -- | -- |
| Core Processor | ARM® Cortex®-M4, C66x | -- | -- | -- |
| RAM Size | 512KB | -- | -- | -- |
| Architecture | DSP, MPU | -- | -- | -- |
| Connectivity | CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB | -- | -- | -- |
| Peripherals | DMA, PWM, WDT | -- | -- | -- |
| Speed | 212.8MHz, 745MHz | -- | -- | -- |
| Mounting Type | -- | Surface Mount | Surface Mount | Surface Mount |
| Type | -- | Advanced Driver Assistance Systems | Advanced Driver Assistance Systems | Advanced Driver Assistance Systems |
| Action |
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