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Texas Instruments LP3923TLX-VI/NOPB Power Management - Specialized

PMU+CHGR+8 LDO+1 BUCK 30USMD

55Texas Instruments30-WFBGARoHS
LP3923TLX-VI/NOPB - No Image Available

Same model may have multiple batches, images only for reference.

LP3923TLX-VI/NOPB
Manufacturer
Part Number (MPN)
LP3923TLX-VI/NOPB
Detailed Description
PMU+CHGR+8 LDO+1 BUCK 30USMD
Package
30-WFBGA
Key Features
Package / Case: 30-WFBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF LP3923TLX-VI/NOPB Datasheet
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Technical Specifications

Texas Instruments LP3923TLX-VI/NOPB Power Management - Specialized technical specifications.

General

Package / Case
30-WFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
3V ~ 5.5V
Applications
Cellular, CDMA Handset

Alternate Parts Comparison (LP3923TLX-VI/NOPB vs LP5907UVX-1.2/NOPB vs LP38691QSDX-3.3/NOPB vs LP5907UVX-3.1/NOPB)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case30-WFBGA4-XFBGA, DSBGA6-WDFN Exposed Pad4-XFBGA, DSBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C-40°C ~ 125°C-40°C ~ 125°C-40°C ~ 125°C
Number of Pins--464
Accuracy--±2%±2%±2%
AEC Qualified--NoYesNo
Automotive--NoYesNo
Basic Package Type--Ball Grid ArrayNon-Lead-Frame SMTBall Grid Array
Cage Code--012950129501295
Current Supply Max--425 µA100 µA425 µA
Junction to Ambient--206.1°C/W50.5°C/W206.1°C/W
Junction to Case--1.5°C/W52.6°C/W1.5°C/W
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