Texas Instruments LM833N/NOPB Amplifiers - Instrumentation, OP Amps, Buffer Amps
IC AUDIO 2 CIRCUIT 8DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LM833N/NOPB
Category
Detailed Description
IC AUDIO 2 CIRCUIT 8DIP
Package
8-DIP (0.300", 7.62mm)
Key Features
Package / Case: 8-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
LM833N/NOPB Datasheet
Quick Jump:
Technical Specifications
Texas Instruments LM833N/NOPB Amplifiers - Instrumentation, OP Amps, Buffer Amps technical specifications.
General
RoHS
Yes
Number of Channels
2
Package / Case
8-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C
Lifecycle Status
Active
Current Supply
5mA (x2 Channels)
Number of Circuits
2
Amplifier Type
Audio
Current Output Channel
40 mA
Alternate Parts Comparison (LM833N/NOPB vs LM2904N/NOPB vs OP07DPE4 vs INA131AP)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-DIP | 8-DIP | 8-PDIP | 8-DIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | 0°C ~ 70°C | -40°C ~ 85°C |
| Number of Channels | 2 | 2 | 1 Channel | 1 Channel |
| RoHS | Yes | Yes | Yes | Yes |
| Amplifier Type | Audio | General Purpose | General Purpose | Instrumentation |
| Current Input Bias | 500 nA | 45 nA | 2 nA | 500 pA |
| Number of Circuits | 2 | 2 | 1 | 1 |
| Package | PDIP (P)-8 | PDIP (P)-8 | 8-DIP (0.300", 7.62mm) | 8-DIP |
| Voltage Input Offset | 300 µV | 2 mV | 60 µV | 25 µV |
| Voltage Supply Span Max | 30 V | 32 V | 36 V | 36 V |
| Voltage Supply Span Min | 30 V | 3 V | 6 V | 4.5 V |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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