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Texas Instruments DS90C032-MD8 Drivers, Receivers, Transceivers

DS90C032-MD8 - Gel-pak, waffle pack, wafer, diced wafer on film

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DS90C032-MD8 - No Image Available

Same model may have multiple batches, images only for reference.

DS90C032-MD8
Manufacturer
Part Number (MPN)
DS90C032-MD8
Detailed Description
DS90C032-MD8 - Gel-pak, waffle pack, wafer, diced wafer on film
Package
Die
Key Features
Package / Case: Die
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DS90C032-MD8 Datasheet
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Technical Specifications

Texas Instruments DS90C032-MD8 Drivers, Receivers, Transceivers technical specifications.

General

Protocol
LVDS
Package / Case
Die
Supply Voltage
4.5V ~ 5.5V
Type
Receiver
Data Rate
155.5Mbps
Numberof Drivers Receivers
0/4

Alternate Parts Comparison (DS90C032-MD8 vs DS26C32ATM vs DS16F95 MDA vs DS90C031 MDR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / CaseDie16-SOICDieDie
Supply Voltage4.5V ~ 5.5V5V4.5V ~ 5.5V4.5V ~ 5.5V
ProtocolLVDSRS422, RS423RS422, RS485LVDS
TypeReceiverReceiverTransceiverDriver
Mounting Type--Surface MountSurface MountSurface Mount
Operating Temperature---40°C ~ 85°C-55°C ~ 180°C-55°C ~ 125°C (TA)
Number of Drivers Receivers--0/41/14/0
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