TDK C3216X7R1E106KT000N Ceramic Capacitors
Cap Ceramic MLCC 10uF ±10% 25V X7R 1206
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
C3216X7R1E106KT000N
Base Model
Detailed Description
Cap Ceramic MLCC 10uF ±10% 25V X7R 1206
Package
1206 (3216Metric)
Lifecycle Status
Active
Datasheet
Quick Jump:
Technical Specifications
TDK C3216X7R1E106KT000N Ceramic Capacitors technical specifications.
General
RoHS
Yes
Feature Capacitance Value
10uF
Feature Tolerance
10%
Feature Voltage
25VDC
Feature Dielectric
X7R
Feature Technology
Standard
Feature Special Features
High Ripple Resistance|Low ESR and ESL|Low Self-Heating|Non Polar Device
Feature Construction
Flat
Feature Termination Style
Pad
Feature Case Style
Ceramic Chip
Related Parts Comparison (C3216X7R1E106KT000N vs C3216X5R1E476MTJ00E vs C3216X5R1E336MT000E vs C3216X7T2W104KT000N)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| RoHS | Yes | -- | Compliant | Compliant |
| Feature AEC Qualified | No | -- | -- | -- |
| Feature Auto Motive | No | -- | -- | -- |
| Feature Capacitance Value | 10uF | -- | -- | -- |
| Feature Case Style | Ceramic Chip | -- | -- | -- |
| Feature Cecc Qualified | No | -- | -- | -- |
| Feature Construction | Flat | -- | -- | -- |
| Feature Dielectric | X7R | -- | -- | -- |
| Feature Military | No | -- | -- | -- |
| Feature P Pap | No | -- | -- | -- |
| Feature Packaging | Tape and Reel | -- | -- | -- |
| Feature Special Features | High Ripple Resistance|Low ESR and ESL|Low Self-Heating|Non Polar Device | -- | -- | -- |
| Action |
More Parts in Ceramic Capacitors
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
